Dingchang Lin
Postdoctoral Fellow
Department of Chemistry & Chemical Biology
Harvard University
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Recent publication highlights

The conductive bonding between "soft" and "rigid".
Although flexible electronics have shown great promises for neuroscience and biomedical applications, the data transmission and processing still rely mainly on silicon-based electronics and integrated circuits that are rigid in nature. However, a reliable and facile electrical connection between the two is heretofore absent.
In this work, we developed a facile, robust and scalable direct contact methodology that enables low-resistance connections between the miniature flexible devices and the metal leads on the commercial electronics. This innovation bridges the gap between flexible electronics and rigid integrated circuits, facilitates the translation of miniature flexible devices to brain science and human healthcare.


